Intel EU80570PJ0676MN Datenblatt

Document Number: 318734-015 Intel® Core™2 Duo Processor E8000∆ and E7000∆ Series, Intel® Pentium® Dual-Core Processor E6000∆ and E5000∆ Series

10 Thermal and Mechanical Design Guidelines

Case Temperature Reference Metrology 100 Thermal and Mechanical Design Guidelines 25. Lift the heater block and magnified lens, using tweezers

Case Temperature Reference Metrology Thermal and Mechanical Design Guidelines 101 Figure 7-31. Thermocouple placed into groove 29. Using a

Case Temperature Reference Metrology 102 Thermal and Mechanical Design Guidelines 31. Fill the rest of the groove with Loctite* 498 Adhesive.

Case Temperature Reference Metrology Thermal and Mechanical Design Guidelines 103 Figure 7-35. Removing Excess Adhesive from IHS 33. Using

Case Temperature Reference Metrology 104 Thermal and Mechanical Design Guidelines D.6 Thermocouple Wire Management When installing the proces

Balanced Technology Extended (BTX) System Thermal Considerations Thermal and Mechanical Design Guidelines 105 Appendix E Balanced Technology E

Balanced Technology Extended (BTX) System Thermal Considerations 106 Thermal and Mechanical Design Guidelines The thermal sensor location and

Balanced Technology Extended (BTX) System Thermal Considerations Thermal and Mechanical Design Guidelines 107 Figure 7-39. Thermal sensor Loca

Balanced Technology Extended (BTX) System Thermal Considerations 108 Thermal and Mechanical Design Guidelines

Fan Performance for Reference Design Thermal and Mechanical Design Guidelines 109 Appendix F Fan Performance for Reference Design The fan powe

Introduction Thermal and Mechanical Design Guidelines 11 1 Introduction 1.1 Document Goals and Scope 1.1.1 Importance of Thermal Management

Fan Performance for Reference Design 110 Thermal and Mechanical Design Guidelines

Mechanical Drawings Thermal and Mechanical Design Guidelines 111 Appendix G Mechanical Drawings The following table lists the mechanical drawi

Mechanical Drawings 112 Thermal and Mechanical Design Guidelines Figure 7-40. ATX/µATX Motherboard Keep-out Footprint Definition and Height Rest

Mechanical Drawings Thermal and Mechanical Design Guidelines 113 Figure 7-41. ATX/µATX Motherboard Keep-out Footprint Definition and Height Re

Mechanical Drawings 114 Thermal and Mechanical Design Guidelines Figure 7-42. ATX/µATX Motherboard Keep-out Footprint Definition and Height Rest

Mechanical Drawings Thermal and Mechanical Design Guidelines 115 Figure 7-43. BTX Thermal Module Keep Out Volumetric – Sheet 1

Mechanical Drawings 116 Thermal and Mechanical Design Guidelines Figure 7-44. BTX Thermal Module Keep Out Volumetric – Sheet 2

Mechanical Drawings Thermal and Mechanical Design Guidelines 117 Figure 7-45. BTX Thermal Module Keep Out Volumetric – Sheet 3

Mechanical Drawings 118 Thermal and Mechanical Design Guidelines Figure 7-46. BTX Thermal Module Keep Out Volumetric – Sheet 4

Mechanical Drawings Thermal and Mechanical Design Guidelines 119 Figure 7-47. BTX Thermal Module Keep Out Volumetric – Sheet 5

Introduction 12 Thermal and Mechanical Design Guidelines 1.1.3 Document Scope This design guide supports the following processors: • Intel®

Mechanical Drawings 120 Thermal and Mechanical Design Guidelines Figure 7-48. ATX Reference Clip – Sheet 1 8 7

Mechanical Drawings Thermal and Mechanical Design Guidelines 121 Figure 7-49. ATX Reference Clip - Sheet 2 HGFEDCBAHGFEDCBA8

Mechanical Drawings 122 Thermal and Mechanical Design Guidelines Figure 7-50. Reference Fastener - Sheet 1

Mechanical Drawings Thermal and Mechanical Design Guidelines 123 Figure 7-51. Reference Fastener - Sheet 2

Mechanical Drawings 124 Thermal and Mechanical Design Guidelines Figure 7-52. Reference Fastener - Sheet 3

Mechanical Drawings Thermal and Mechanical Design Guidelines 125 Figure 7-53. Reference Fastener - Sheet 4

Mechanical Drawings 126 Thermal and Mechanical Design Guidelines Figure 7-54. Intel® E18764-001 Reference Solution Assembly

Intel® Enabled Reference Solution Information Thermal and Mechanical Design Guidelines 127 Appendix H Intel® Enabled Reference Solution Inform

Intel® Enabled Reference Solution Information 128 Thermal and Mechanical Design Guidelines Note: These vendors and devices are listed by Inte

Introduction Thermal and Mechanical Design Guidelines 13 1.2 References Material and concepts available in the following documents may be ben

Introduction 14 Thermal and Mechanical Design Guidelines Term Description ΨCS Case-to-sink thermal characterization parameter. A measure of t

Processor Thermal/Mechanical Information Thermal and Mechanical Design Guidelines 15 2 Processor Thermal/Mechanical Information 2.1 Mechanic

Processor Thermal/Mechanical Information 16 Thermal and Mechanical Design Guidelines The primary function of the IHS is to transfer the non-un

Processor Thermal/Mechanical Information Thermal and Mechanical Design Guidelines 17 2.1.2 Heatsink Attach 2.1.2.1 General Guidelines There

Processor Thermal/Mechanical Information 18 Thermal and Mechanical Design Guidelines 2.1.2.3 Additional Guidelines In addition to the general

Processor Thermal/Mechanical Information Thermal and Mechanical Design Guidelines 19 Figure 2-2. Processor Case Temperature Measurement Locati

2 Thermal and Mechanical Design Guidelines THIS DOCUMENT AND RELATED MATERIALS AND INFORMATION ARE PROVIDED “AS IS” WITH NO WARRAN

Processor Thermal/Mechanical Information 20 Thermal and Mechanical Design Guidelines The thermal profiles for the Intel Core™2 Duo processor E

Processor Thermal/Mechanical Information Thermal and Mechanical Design Guidelines 21 This is achieved in part by using the ΨCA versus RPM and

Processor Thermal/Mechanical Information 22 Thermal and Mechanical Design Guidelines required to meet a required performance. As the heatsink

Processor Thermal/Mechanical Information Thermal and Mechanical Design Guidelines 23 The recommended maximum heatsink mass for the ATX thermal

Processor Thermal/Mechanical Information 24 Thermal and Mechanical Design Guidelines 2.4 System Thermal Solution Considerations 2.4.1 Chassi

Processor Thermal/Mechanical Information Thermal and Mechanical Design Guidelines 25 In addition to passive heatsinks, fan heatsinks and syste

Processor Thermal/Mechanical Information 26 Thermal and Mechanical Design Guidelines

Thermal Metrology Thermal and Mechanical Design Guidelines 27 3 Thermal Metrology This section discusses guidelines for testing thermal solut

Thermal Metrology 28 Thermal and Mechanical Design Guidelines ΨSA is a measure of the thermal characterization parameter from the bottom of th

Thermal Metrology Thermal and Mechanical Design Guidelines 29 Assume the TDP, as listed in the datasheet, is 100 W and the maximum case temper

Thermal and Mechanical Design Guidelines 3 Contents 1 Introduction ...

Thermal Metrology 30 Thermal and Mechanical Design Guidelines For active heatsinks, it is important to avoid taking measurement in the dead fl

Thermal Metrology Thermal and Mechanical Design Guidelines 31 Figure 3-2. Locations for Measuring Local Ambient Temperature, Active ATX Heatsi

Thermal Metrology 32 Thermal and Mechanical Design Guidelines 3.4 Processor Case Temperature Measurement Guidelines To ensure functionality a

Thermal Management Logic and Thermal Monitor Feature Thermal and Mechanical Design Guidelines 33 4 Thermal Management Logic and Thermal Monit

Thermal Management Logic and Thermal Monitor Feature 34 Thermal and Mechanical Design Guidelines 4.2.1 PROCHOT# Signal The primary function o

Thermal Management Logic and Thermal Monitor Feature Thermal and Mechanical Design Guidelines 35 Figure 4-1. Thermal Monitor Control PROCHOT#

Thermal Management Logic and Thermal Monitor Feature 36 Thermal and Mechanical Design Guidelines Once the processor has sufficiently cooled, a

Thermal Management Logic and Thermal Monitor Feature Thermal and Mechanical Design Guidelines 37 Regardless of the configuration selected, PRO

Thermal Management Logic and Thermal Monitor Feature 38 Thermal and Mechanical Design Guidelines A system designed to meet the thermal profile

Thermal Management Logic and Thermal Monitor Feature Thermal and Mechanical Design Guidelines 39 4.2.10 Digital Thermal Sensor Multiple digit

4 Thermal and Mechanical Design Guidelines 4.2.6 System Considerations ... 37 4.2

Thermal Management Logic and Thermal Monitor Feature 40 Thermal and Mechanical Design Guidelines 4.2.11 Platform Environmental Control Interf

Balanced Technology Extended (BTX) Thermal/Mechanical Design Information Thermal and Mechanical Design Guidelines 41 5 Balanced Technology Ex

Balanced Technology Extended (BTX) Thermal/Mechanical Design Information 42 Thermal and Mechanical Design Guidelines 5.1.2 Acoustics To optim

Balanced Technology Extended (BTX) Thermal/Mechanical Design Information Thermal and Mechanical Design Guidelines 43 5.1.3 Effective Fan Curv

Balanced Technology Extended (BTX) Thermal/Mechanical Design Information 44 Thermal and Mechanical Design Guidelines Figure 5-1. Effective TMA

Balanced Technology Extended (BTX) Thermal/Mechanical Design Information Thermal and Mechanical Design Guidelines 45 5.1.5 Altitude The refer

Balanced Technology Extended (BTX) Thermal/Mechanical Design Information 46 Thermal and Mechanical Design Guidelines Figure 5-2. Random Vibrat

Balanced Technology Extended (BTX) Thermal/Mechanical Design Information Thermal and Mechanical Design Guidelines 47 5.2.1.2.1 Recommended Te

Balanced Technology Extended (BTX) Thermal/Mechanical Design Information 48 Thermal and Mechanical Design Guidelines 5.2.3 Recommended BIOS/C

Balanced Technology Extended (BTX) Thermal/Mechanical Design Information Thermal and Mechanical Design Guidelines 49 5.4 Safety Requirements

Thermal and Mechanical Design Guidelines 5 7.3 Intel® QST Configuration and Tuning ...

Balanced Technology Extended (BTX) Thermal/Mechanical Design Information 50 Thermal and Mechanical Design Guidelines 5.6 Preload and TMA Stif

Balanced Technology Extended (BTX) Thermal/Mechanical Design Information Thermal and Mechanical Design Guidelines 51 Table 5–4. Processor Prel

Balanced Technology Extended (BTX) Thermal/Mechanical Design Information 52 Thermal and Mechanical Design Guidelines mounting hole position fo

ATX Thermal/Mechanical Design Information Thermal and Mechanical Design Guidelines 53 6 ATX Thermal/Mechanical Design Information 6.1 ATX Re

ATX Thermal/Mechanical Design Information 54 Thermal and Mechanical Design Guidelines Figure 6-1. E18764-001 Reference Design – Exploded View

ATX Thermal/Mechanical Design Information Thermal and Mechanical Design Guidelines 55 6.2 Validation Results for Reference Design 6.2.1 Heat

ATX Thermal/Mechanical Design Information 56 Thermal and Mechanical Design Guidelines 6.2.2 Acoustics To optimize acoustic emission by the fa

ATX Thermal/Mechanical Design Information Thermal and Mechanical Design Guidelines 57 6.2.4 Heatsink Thermal Validation Intel recommends eval

ATX Thermal/Mechanical Design Information 58 Thermal and Mechanical Design Guidelines Figure 6-3. Random Vibration PSD 6.3.1.2 Shock Test Pr

ATX Thermal/Mechanical Design Information Thermal and Mechanical Design Guidelines 59 6.3.1.2.1 Recommended Test Sequence Each test sequence

6 Thermal and Mechanical Design Guidelines Figures Figure 2-1. Package IHS Load Areas ...

ATX Thermal/Mechanical Design Information 60 Thermal and Mechanical Design Guidelines 6.3.3 Recommended BIOS/CPU/Memory Test Procedures This

ATX Thermal/Mechanical Design Information Thermal and Mechanical Design Guidelines 61 6.5 Safety Requirements Heatsink and attachment assembl

ATX Thermal/Mechanical Design Information 62 Thermal and Mechanical Design Guidelines 6.7 Reference Attach Mechanism 6.7.1 Structural Design

ATX Thermal/Mechanical Design Information Thermal and Mechanical Design Guidelines 63 6.7.2 Mechanical Interface to the Reference Attach Mech

ATX Thermal/Mechanical Design Information 64 Thermal and Mechanical Design Guidelines Figure 6-7. Critical Parameters for Interfacing to Refer

Intel® Quiet System Technology (Intel® QST) Thermal and Mechanical Design Guidelines 65 7 Intel® Quiet System Technology (Intel® QST) In the

Intel® Quiet System Technology (Intel® QST) 66 Thermal and Mechanical Design Guidelines Figure 7-1. Intel® QST Overview 7.1.1 Output Weighti

Intel® Quiet System Technology (Intel® QST) Thermal and Mechanical Design Guidelines 67 temperature to the target temperature. As a result of

Intel® Quiet System Technology (Intel® QST) 68 Thermal and Mechanical Design Guidelines 7.2 Board and System Implementation of Intel® QST To

Intel® Quiet System Technology (Intel® QST) Thermal and Mechanical Design Guidelines 69 Figure 7-4 shows the major connections for a typical i

Thermal and Mechanical Design Guidelines 7 Figure 7-27. Solder Station Setup ...

Intel® Quiet System Technology (Intel® QST) 70 Thermal and Mechanical Design Guidelines 7.3 Intel® QST Configuration and Tuning Initial confi

LGA775 Socket Heatsink Loading Thermal and Mechanical Design Guidelines 71 Appendix A LGA775 Socket Heatsink Loading A.1 LGA775 Socket Heatsi

LGA775 Socket Heatsink Loading 72 Thermal and Mechanical Design Guidelines Simulation shows that the solder joint force (Faxial) is proportion

LGA775 Socket Heatsink Loading Thermal and Mechanical Design Guidelines 73 Figure 7-6. Board Deflection Definition d1 d2 d’1 d’2 A.3.2 Boar

LGA775 Socket Heatsink Loading 74 Thermal and Mechanical Design Guidelines A.3.3 Board Deflection Metric Implementation Example This section

LGA775 Socket Heatsink Loading Thermal and Mechanical Design Guidelines 75 Figure 7-7. Example—Defining Heatsink Preload Meeting Board Deflect

LGA775 Socket Heatsink Loading 76 Thermal and Mechanical Design Guidelines A.3.4.1 Motherboard Stiffening Considerations To protect LGA775 so

Heatsink Clip Load Metrology Thermal and Mechanical Design Guidelines 77 Appendix B Heatsink Clip Load Metrology B.1 Overview This appendix d

Heatsink Clip Load Metrology 78 Thermal and Mechanical Design Guidelines Remarks: Alternate Heatsink Sample Preparation As mentioned above, ma

Heatsink Clip Load Metrology Thermal and Mechanical Design Guidelines 79 Figure 7-9. Load Cell Installation in Machined Heatsink Base Pocket –

8 Thermal and Mechanical Design Guidelines Tables Table 2–1. Heatsink Inlet Temperature of Intel Reference Thermal Solutions ... 24 T

Heatsink Clip Load Metrology 80 Thermal and Mechanical Design Guidelines B.2.2 Typical Test Equipment For the heatsink clip load measurement,

Heatsink Clip Load Metrology Thermal and Mechanical Design Guidelines 81 B.3.1 Time-Zero, Room Temperature Preload Measurement 1. Pre-assemb

Heatsink Clip Load Metrology 82 Thermal and Mechanical Design Guidelines

Thermal Interface Management Thermal and Mechanical Design Guidelines 83 Appendix C Thermal Interface Management To optimize a heatsink design

Thermal Interface Management 84 Thermal and Mechanical Design Guidelines §

Case Temperature Reference Metrology Thermal and Mechanical Design Guidelines 85 Appendix D Case Temperature Reference Metrology D.1 Objectiv

Case Temperature Reference Metrology 86 Thermal and Mechanical Design Guidelines Item Description Part Number Miscellaneous Hardware Solder

Case Temperature Reference Metrology Thermal and Mechanical Design Guidelines 87 D.3 Thermal Calibration and Controls It is recommended that

Case Temperature Reference Metrology 88 Thermal and Mechanical Design Guidelines Figure 7-12. 775-LAND LGA Package Reference Groove Drawing at

Case Temperature Reference Metrology Thermal and Mechanical Design Guidelines 89 Figure 7-13. 775-LAND LGA Package Reference Groove Drawing at 3

Thermal and Mechanical Design Guidelines 9 Revision History Revision Number Description Revision 001 • Initial release. January 2008 002 •

Case Temperature Reference Metrology 90 Thermal and Mechanical Design Guidelines The orientation of the groove at 6 o’clock exit relative to t

Case Temperature Reference Metrology Thermal and Mechanical Design Guidelines 91 D.5 Thermocouple Attach Procedure The procedure to attach a

Case Temperature Reference Metrology 92 Thermal and Mechanical Design Guidelines 5. Using the microscope and tweezers, bend the tip of the th

Case Temperature Reference Metrology Thermal and Mechanical Design Guidelines 93 9. Lift the wire at the middle of groove with tweezers and b

Case Temperature Reference Metrology 94 Thermal and Mechanical Design Guidelines 11. While still at the microscope, press the wire down about

Case Temperature Reference Metrology Thermal and Mechanical Design Guidelines 95 Figure 7-22. Third Tape Installation 12. Place a 3rd piece o

Case Temperature Reference Metrology 96 Thermal and Mechanical Design Guidelines 14. Using a fine point device, place a small amount of flux o

Case Temperature Reference Metrology Thermal and Mechanical Design Guidelines 97 16. Place the two pieces of solder in parallel, directly over

Case Temperature Reference Metrology 98 Thermal and Mechanical Design Guidelines Figure 7-27. Solder Station Setup 21. Remove the land side

Case Temperature Reference Metrology Thermal and Mechanical Design Guidelines 99 24. You may need to move the solder back toward the groove as