Intel 8mb Bedienungsanleitung

LGA1150 SocketApplication GuideSeptember 2013Order No.: 328999-002

Figure 2. LGA1150 Socket Land PatternAttachment to MotherboardThe socket is attached to the motherboard by 1150 solder balls. There are noadditional e

Figure 3. Attachment to MotherboardSocket ComponentsThe socket has two main components, the socket body and Pick and Place (PnP)cover, and is delivere

• Lead free SAC (SnAgCu) 305 solder alloy with a silver (Ag) content between 3%and 4% and a melting temperature of approximately 217 °C. The alloy isc

Figure 4. Pick and Place CoverPackage Installation / RemovalAs indicated in Figure 5 on page 14, access is provided to facilitate manualinstallation a

Figure 5. Package Installation / Removal FeaturesSocket Standoffs and Package Seating PlaneStandoffs on the bottom of the socket base establish the mi

Component Insertion ForcesAny actuation must meet or exceed SEMI S8-95 Safety Guidelines for Ergonomics/Human Factors Engineering of Semiconductor Man

3.0 Independent Loading Mechanism (ILM)The ILM has two critical functions – deliver the force to seat the processor onto thesocket contacts and distr

The ILM assembly design ensures that, once assembled to the back plate, the onlyfeatures touching the board are the shoulder screw and the insulated h

• Desktop ILM back plate using marking “115XDBP” versus server ILM back plateusing marking “115XSBP”.Note: When reworking a BGA component or the sock

Figure 8. Shoulder ScrewAssembly of Independent Loading Mechanism (ILM) to aMotherboardThe ILM design allows a bottoms up assembly of the components t

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OROTHERWISE, TO ANY INTELLECTU

Figure 9. Independent Loading Mechanism (ILM) AssemblyAs indicated in Figure 10 on page 20, the shoulder screw, socket protrusion and ILMkey features

Independent Loading Mechanism (ILM)InterchangeabilityILM assembly and ILM back plate built from the Intel controlled drawings are intendedto be interc

• The ILM cover for the LGA115x socket will have a flammability rating of V-2 perUL 60950-1.Note: The ILM Cover pop off feature is not supported if t

Figure 12. ILM Cover and PnP Cover InterferenceAs indicated in Figure 12 on page 23, the pick and place cover cannot remain in placeand used in conjun

4.0 LGA1150 Socket and ILM SpecificationsThis chapter describes the following specifications and requirements:• Mechanical Specifications on page 24•

Table 5 on page 25 provides load specifications for the LGA1150 socket with the ILMinstalled. The maximum limits should not be exceeded during heatsin

Table 6. Electrical Requirements for LGA1150 SocketParameter Value CommentMated loop inductance, Loop<3.6nHThe inductance calculated for two contac

Figure 13. Flow Chart of Knowledge-Based Reliability Evaluation MethodologyA detailed description of this methodology can be found at:ftp://download.i

Appendix A Component SuppliersNote: The part numbers listed below identifies the reference components. End-users areresponsible for the verification

Appendix B Mechanical DrawingsThe following table lists the mechanical drawings included in this appendix.Table 9. Mechanical Drawing ListDrawing Desc

ContentsRevision History...61.0 Introdu

Figure 14. Socket/Heatsink / ILM Keep-out Zone Primary Side (Top)LGA1150 Socket—Mechanical DrawingsLGA1150 SocketApplication Guide September 201330 Or

Figure 15. Socket / Heatsink / ILM Keep-out Zone Secondary Side (Bottom)Mechanical Drawings—LGA1150 SocketLGA1150 SocketSeptember 2013 Application Gui

Figure 16. Socket / Processor / ILM Keep-out Zone Primary Side (Top)LGA1150 Socket—Mechanical DrawingsLGA1150 SocketApplication Guide September 201332

Figure 17. Socket / Processor / ILM Keep-out Zone Secondary Side (Bottom)Mechanical Drawings—LGA1150 SocketLGA1150 SocketSeptember 2013 Application Gu

Appendix C Heatsink Back Plate DrawingsThis heatsink back plate design is intended to adapt as a reference for OEMs that usethreaded fasteners on cust

Figure 18. Heatsink Back Plate Keep-in ZoneHeatsink Back Plate Drawings—LGA1150 SocketLGA1150 SocketSeptember 2013 Application GuideOrder No.: 328999-

Figure 19. Heatsink Back PlateLGA1150 Socket—Heatsink Back Plate DrawingsLGA1150 SocketApplication Guide September 201336 Order No.: 328999-002

Figures1 LGA1150 Pick and Place Cover... 92 LGA1150 Socket Land

Tables1 Related Documents ...72 Terms and Descri

Revision HistoryRevision Number Description Revision Date001 • Initial release June 2013002 • Added Desktop Intel® Pentium processor family September

1.0 IntroductionThis document covers the LGA1150 socket for Desktop systems using the Desktop 4thGeneration Intel® Core™ processor family, Desktop In

Term DescriptionFSC Fan Speed ControlIHS Integrated Heat Spreader: a component of the processor package used to enhance thethermal performance of the

2.0 LGA1150 SocketThis chapter describes a surface mount, LGA (Land Grid Array) socket intended for theprocessors. The socket provides I/O, power and