Intel BX80525U533512E Datenblatt

Intel® Pentium® III Processor for the SC242 at 450 MHz to 1.0 GHzDatasheetProduct FeaturesThe Intel® Pentium® III processor is designed for high-perfo

10 DatasheetIntroduction1.1 TerminologyIn this document, a ‘#’ symbol after a signal name refers to an active low signal. This means that a signal is

100 DatasheetIntel® Pentium® III Processor Signal Description7.2 Signal SummariesTable 42 through Table 45 list attributes of the processor output, i

Datasheet 101Intel® Pentium® III Processor Signal DescriptionTable 44. Input/Output Signals (Single Driver)Name Active Level Clock Signal Group Quali

Datasheet 11Introduction1.1.2 Processor Naming ConventionA letter(s) is added to certain processors (e.g., 600B MHz) when the core frequency alone may

12 DatasheetIntroduction1.2 Related DocumentsThe reader of this specification should also be familiar with material and concepts in the documents lis

Datasheet 13Electrical Specifications2.0 Electrical Specifications2.1 Processor System Bus and VREFMost Pentium III processor signals use a variation

14 DatasheetElectrical Specifications2.2 Clock Control and Low Power StatesPentium III processors allow the use of AutoHALT, Stop-Grant, Sleep, and D

Datasheet 15Electrical SpecificationsFor the processor to fully realize the low current consumption of the Stop-Grant, Sleep, and Deep Sleep states, a

16 DatasheetElectrical Specifications2.2.4 HALT/Grant Snoop State—State 4The processor will respond to snoop transactions on the Pentium III processo

Datasheet 17Electrical Specifications2.2.7 Clock ControlThe processor provides the clock signal to the L2 cache. During AutoHALT Power Down and Stop-G

18 DatasheetElectrical Specifications2.4.1 Processor VCCCORE DecouplingRegulator solutions need to provide bulk capacitance with a low Effective Seri

Datasheet 19Electrical SpecificationsNOTES:1. 0 = Processor pin connected to VSS.2. 1 = Open on processor; may be pulled up to TTL VIH on baseboard.3.

Datasheet INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO

20 DatasheetElectrical Specificationsvoltage regulator is stable. This will prevent the possibility of the processor supply going above the specified

Datasheet 21Electrical SpecificationsNOTES:1. The BR0# pin is the only BREQ# signal that is bidirectional. The internal BREQ# signals are mapped onto

22 DatasheetElectrical Specifications2.8.2 System Bus Frequency Select Signal (BSEL0)The BSEL[1:0] signals (BSEL0 is also known as 100/66#) are used

Datasheet 23Electrical Specifications2.9 Test Access Port (TAP) ConnectionDue to the voltage levels supported by other components in the Test Access P

24 DatasheetElectrical Specifications2.10 Maximum RatingsTable 6 contains Pentium III processor stress ratings only. Functional operation at the abso

Datasheet 25Electrical SpecificationsNOTES:1. Operating voltage is the voltage to which the component is designed to operate. See Table 7.2. Input vol

26 DatasheetElectrical SpecificationsTable 8. Voltage and Current Specifications (Sheet 1 of 4)Symbol ParameterProcessorMin Typ Max Unit Notes1Core

Datasheet 27Electrical SpecificationsVccCOREVcc for Processor Core800EB MHz0681h 1.65V2,3,4,50683h 1.65 2,3,4,50686h 1.70 2,3,4,5850 MHz0681h 1.65 2,3

28 DatasheetElectrical SpecificationsICCCOREICC for processor core450 MHz500 MHz 533B MHz 533EB MHz550 MHz550E MHz600 MHz 600B MHz 600E MHz600EB MHz6

Datasheet 29Electrical SpecificationsNOTES:1. Unless otherwise noted, all specifications in this table apply to all processor frequencies.2. This spec

Datasheet 3Contents1.0 Introduction...

30 DatasheetElectrical Specifications9. VCCL2/VCC3.3 and ICCL2/ICC3.3 supply the second level cache (“Discrete” cache type only). Unless otherwise no

Datasheet 31Electrical SpecificationsNOTES:1. Unless otherwise noted, all specifications in this table apply to Pentium III processor frequencies.2. V

32 DatasheetElectrical Specifications2.12 AGTL+ System Bus SpecificationsIt is recommended that the AGTL+ bus be routed in a daisy-chain fashion with

Datasheet 33Electrical SpecificationsThe timings specified in this section should be used in conjunction with the I/O buffer models provided by Intel.

34 DatasheetElectrical SpecificationsNOTE:1. Contact your local Intel representative for the latest information on processor frequencies and/or frequ

Datasheet 35Electrical SpecificationsNOTES:1. Unless otherwise noted, all specifications in this table apply to all Pentium III processor frequencies.

36 DatasheetElectrical Specifications.NOTES:1. Unless otherwise noted, all specifications in this table apply to all Pentium III processor frequencie

Datasheet 37Electrical SpecificationsNOTES:1. Unless otherwise noted, all specifications in this table apply to all Pentium III processor frequencies.

38 DatasheetElectrical Specifications Figure 8. System Bus Valid Delay TimingsFigure 9. System Bus Setup and Hold TimingsFigure 10. System Bus Rese

Datasheet 39Electrical SpecificationsFigure 11. Power-On Reset and Configuration TimingsFigure 12. Test Timings (TAP Connection)Figure 13. Test Reset

4 Datasheet 4.0 Thermal Specifications and Design Considerations...494.1 Thermal Specificatio

40 DatasheetSignal Quality Specifications3.0 Signal Quality SpecificationsSignals driven on the Pentium III processor system bus should meet signal q

Datasheet 41Signal Quality Specifications3.2 AGTL+ and Non-AGTL+ Overshoot/Undershoot Specifications and Measurement GuidelinesOvershoot/Undershoot is

42 DatasheetSignal Quality Specifications3.2.2 Overshoot/Undershoot Pulse DurationOvershoot/Undershoot Pulse duration describes the total time an ove

Datasheet 43Signal Quality Specifications3.2.4 Reading Overshoot/Undershoot Specification TablesThe overshoot/undershoot specification for the Pentium

44 DatasheetSignal Quality Specifications3.2.5 Determining If a System Meets the Overshoot/Undershoot SpecificationsThe overshoot/undershoot specific

Datasheet 45Signal Quality SpecificationsNOTES:1. BCLK period is 7.5 ns.2. These values are specified at the processor core pins.3. Overshoot/Undersho

46 DatasheetSignal Quality Specifications3.3 AGTL+ and Non-AGTL+ Ringback Specifications and Measurement GuidelinesRingback refers to the amount of r

Datasheet 47Signal Quality SpecificationsNOTES:1. Unless otherwise noted, all specifications in this table apply to all Pentium III processor frequenc

48 DatasheetSignal Quality Specifications 3.3.1 Settling Limit GuidelineSettling limit defines the maximum amount of ringing at the receiving pin tha

Datasheet 49Thermal Specifications and Design Considerations4.0 Thermal Specifications and Design ConsiderationsLimited quantities of Pentium III proc

Datasheet 5Figures1 Second Level (L2) Cache Implementation ...92 AGTL+ Bus Topology...

50 DatasheetThermal Specifications and Design Considerations4.1 Thermal SpecificationsTable 25 and Table 26 provide the thermal design power dissipat

Datasheet 51Thermal Specifications and Design ConsiderationsNOTES:1. These values are specified at nominal VCCCORE for the processor core and nominal

52 DatasheetThermal Specifications and Design ConsiderationsFor S.E.C.C. packaged processors, the extended thermal plate is the attach location for a

Datasheet 53Thermal Specifications and Design Considerations4.1.1 Thermal DiodeThe Pentium III processor incorporates an on-die diode that may be used

54 DatasheetS.E.C.C. and S.E.C.C.2 Mechanical Specifications5.0 S.E.C.C. and S.E.C.C.2 Mechanical SpecificationsPentium III processors use either S.E

Datasheet 55S.E.C.C. and S.E.C.C.2 Mechanical SpecificationsFigure 23. S.E.C.C. Packaged Processor — Extended Thermal Plate Side DimensionsFigure 24.

56 DatasheetS.E.C.C. and S.E.C.C.2 Mechanical SpecificationsFigure 25. S.E.C.C. Packaged Processor — Latch Arm, Extended Thermal Plate Lug, and Cover

Datasheet 57S.E.C.C. and S.E.C.C.2 Mechanical SpecificationsFigure 26. S.E.C.C. Packaged Processor — Latch Arm, Extended Thermal Plate, and Cover Deta

58 DatasheetS.E.C.C. and S.E.C.C.2 Mechanical SpecificationsFigure 27. S.E.C.C. Packaged Processor — Extended Thermal Plate Attachment Detail Dimensi

Datasheet 59S.E.C.C. and S.E.C.C.2 Mechanical SpecificationsFigure 28. S.E.C.C. Packaged Processor — Extended Thermal Plate Attachment Detail Dimensio

6 Datasheet 39 S.E.C.C.2 Packaged Processor Substrate — Edge Finger Contact Dimensions (Detail A) ...

60 DatasheetS.E.C.C. and S.E.C.C.2 Mechanical Specifications Figure 30. S.E.C.C. Packaged Processor Substrate — Edge Finger Contact Dimensions, Detai

Datasheet 61S.E.C.C. and S.E.C.C.2 Mechanical Specifications5.2 S.E.C.C.2 Mechanical SpecificationS.E.C.C.2 drawings and dimension details are provide

62 DatasheetS.E.C.C. and S.E.C.C.2 Mechanical SpecificationsFigure 33. S.E.C.C.2 Packaged Processor Assembly — Primary ViewFigure 34. S.E.C.C.2 Packa

Datasheet 63S.E.C.C. and S.E.C.C.2 Mechanical SpecificationsFigure 35. S.E.C.C.2 Packaged Processor Assembly — Heatsink Attach Boss SectionFigure 36.

64 DatasheetS.E.C.C. and S.E.C.C.2 Mechanical SpecificationsFigure 38. S.E.C.C.2 Packaged Processor Substrate — Edge Finger Contact DimensionsFigure

Datasheet 65S.E.C.C. and S.E.C.C.2 Mechanical SpecificationsFigure 40. S.E.C.C.2 Packaged Processor Substrate (CPUID=067xh) — Keep-In ZonesFigure 41.

66 DatasheetS.E.C.C. and S.E.C.C.2 Mechanical SpecificationsFigure 42. S.E.C.C.2 Packaged Processor Substrate (CPUID=067xh) — Keep-Out ZoneFigure 43.

Datasheet 67S.E.C.C. and S.E.C.C.2 Mechanical Specifications5.3 S.E.C.C.2 Structural Mechanical SpecificationThe intention of the structural specifica

68 DatasheetS.E.C.C. and S.E.C.C.2 Mechanical SpecificationsNOTES:1. This is the maximum static force that can be applied by the heatsink to maintain

Datasheet 69S.E.C.C. and S.E.C.C.2 Mechanical Specifications5.4 Processor Package Materials InformationBoth the S.E.C.C. and S.E.C.C.2 processor packa

Datasheet 718 System Bus AC Specifications (TAP Connection) at the Processor Core Pins...

70 DatasheetS.E.C.C. and S.E.C.C.2 Mechanical SpecificationsTable 34. Signal Listing in Order by Pin NumberPin # Pin Name Signal Group Pin # Pin Nam

Datasheet 71 Intel® Pentium® III Processor for the SC242 at 450 MHz to 1.0 GHzA42 GND Power/Other B42 D41# AGTL+ I/OA43 D42# AGTL+ I/O B43 D47# AGTL+

72 DatasheetIntel® Pentium® III Processor for the SC242 at 450 MHz to 1.0 GHz A84 A27# AGTL+ I/O B84 A28# AGTL+ I/OA85 A22# AGTL+ I/O B85 VCCCOREPower

Datasheet 73 Intel® Pentium® III Processor for the SC242 at 450 MHz to 1.0 GHzTable 35. Signal Listing in Order by Signal NamePin Name Pin # Signal G

74 DatasheetIntel® Pentium® III Processor for the SC242 at 450 MHz to 1.0 GHz D31# A53 AGTL+ I/OD32# B51 AGTL+ I/OD33# A51 AGTL+ I/OD34# B48 AGTL+ I/O

Datasheet 75 Intel® Pentium® III Processor for the SC242 at 450 MHz to 1.0 GHzIERR# A4 CMOS OutputIGNNE# A8 CMOS InputINIT# B4 CMOS InputLINT0/INTR A1

76 DatasheetS.E.C.C. and S.E.C.C.2 Mechanical Specifications5.6 Intel® Pentium® III Processor Core Pad to Substrate Via AssignmentsThese test points

Datasheet 77 Intel® Pentium® III Processor for the SC242 at 450 MHz to 1.0 GHzTable 36. Via Listing in Order by Signal NameSignal Name Via LocationsA

78 DatasheetIntel® Pentium® III Processor for the SC242 at 450 MHz to 1.0 GHz D25# I24D26# H23D27# H22D28# H20D29# I21D30# I19D31# H24D32# H21D33# G24

Datasheet 79 Intel® Pentium® III Processor for the SC242 at 450 MHz to 1.0 GHzRSP# V16SLP# O22SMI# Q24STPCLK# P24TCK O20TDI O23TDO N19THERMTRIP# M23TH

8 Datasheet Revision HistoryRevision Description Date-009 • Removed 1.13 GHz processor frequency. Minor edits for clarity. July 2002

80 DatasheetIntel® Pentium® III Processor for the SC242 at 450 MHz to 1.0 GHz VCCCORET5VCCCORET9VCCCORET12VCCCORET19VCCCOREU2VCCCOREU14VCCCOREW1VCCCOR

Datasheet 81 Intel® Pentium® III Processor for the SC242 at 450 MHz to 1.0 GHzVSS Q8VSS Q10VSS Q12VSS Q14VSS Q16VSS Q18VSS R4VSS R9VSS R11VSS R13VSS R

82 DatasheetIntel® Pentium® III Processor for the SC242 at 450 MHz to 1.0 GHz Table 37. Via Listing in Order by VIA LocationVia Locations Signal Name

Datasheet 83 Intel® Pentium® III Processor for the SC242 at 450 MHz to 1.0 GHzG16 BP3#G17 BINT#G18 DEP3#G19 D60#G22 D43#G23 D35#G24 D33#G25 D38#H2 VCC

84 DatasheetIntel® Pentium® III Processor for the SC242 at 450 MHz to 1.0 GHz L14 VCCCOREL16 VCCCOREL18 VSSL19 D7#L20 D6#L21 D9#L22 D8#L23 D4#L25 VSSM

Datasheet 85 Intel® Pentium® III Processor for the SC242 at 450 MHz to 1.0 GHzR8 VCCCORER9 VSSR10 VCCCORER11 VSSR12 VCCCORER13 VSSR14 VCCCORER15 VSSR1

86 DatasheetIntel® Pentium® III Processor for the SC242 at 450 MHz to 1.0 GHz W15 REQ3#W16 REQ4#W17 VSSW18 A4#W19 A8#W20 A11#W21 A16#W22 VSSW23 A19#W2

Datasheet 87S.E.C.C. and S.E.C.C.2 Mechanical Specifications5.6.3 Processor Core Pad Via Assignments (CPUID=068xh)Figure 49 shows the via locations on

88 DatasheetBoxed Processor Specifications6.0 Boxed Processor Specifications6.1 IntroductionThe Pentium III processor is also offered as an Intel box

Datasheet 89Boxed Processor SpecificationsFigure 51. Side View Space Requirements for the Intel® Boxed Processor with S.E.C.C.2 PackagingFigure 52. Fr

Datasheet 9Introduction1.0 IntroductionThe Intel® Pentium®III processor is the next member of the P6 family, in the Intel® IA-32 processor line. Like

90 DatasheetBoxed Processor Specifications6.2.2 Intel® Boxed Processor Fan Heatsink WeightThe boxed processor fan heatsink will not weigh more than 2

Datasheet 91Boxed Processor SpecificationsBaseboards designed to accept both Pentium II processors and Pentium III processors have component height re

92 DatasheetBoxed Processor Specifications6.4 Fan Heatsink Thermal SpecificationsThis section describes the cooling requirements of the fan heatsink

Datasheet 93Intel® Pentium® III Processor Signal Description7.0 Intel® Pentium® III Processor Signal DescriptionThis section provides an alphabetical

94 DatasheetIntel® Pentium® III Processor Signal Description BERR# I/OThe BERR# (Bus Error) signal is asserted to indicate an unrecoverable error wit

Datasheet 95Intel® Pentium® III Processor Signal DescriptionBR0#BR1#I/OIThe BR0# and BR1# (Bus Request) pins drive the BREQ[1:0]# signals in the syste

96 DatasheetIntel® Pentium® III Processor Signal DescriptionEMI IEMI pins should be connected to baseboard ground and/or to chassis ground through ze

Datasheet 97Intel® Pentium® III Processor Signal DescriptionLOCK# I/OThe LOCK# signal indicates to the system that a transaction must occur atomically

98 DatasheetIntel® Pentium® III Processor Signal DescriptionRESET# IAsserting the RESET# signal resets all processors to known states and invalidates

Datasheet 99Intel® Pentium® III Processor Signal DescriptionSMI# IThe SMI# (System Management Interrupt) signal is asserted asynchronously by system l