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ATX Thermal/Mechanical Design Information

54 Thermal and Mechanical Design Guidelines

Figure 6-1. E18764-001 Reference Design – Exploded View

Figure 6-2. Bottom View of Copper Core Applied by TC-1996 Grease

The ATX motherboard keep-out and the height recommendations defined Section 6.6

remain the same for a thermal solution for the processor in the 775-Land LGA

package.

Note: If this fan design is used in your product and you will deliver it to end use customers,

you have the responsibility to determine an adequate level of protection (e.g.,

protection barriers, a cage, or an interlock) against contact with the energized fan by

the user during user servicing.

Note: Development vendor information for the reference design is provided in Appendix H.

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Intel BX80570E8200A Datenblatt Seite 54