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Datasheet, Volume 1 31

Interfaces

2.2.3 PCI Express* Port

The PCI Express interface on the processor is a single, 16-lane (x16) port that can also

be configured at narrower widths. The PCI Express port is being designed to be

compliant with the PCI Express Base Specification, Revision 3.0.

2.2.3.1 PCI Express* Lanes Connection

Figure 2-5 demonstrates the PCIe lanes mapping.

Figure 2-5. PCI Express* Typical Operation 16 Lanes Mapping

1 X 16 Controller

Lane 0

Lane 1

Lane 2

Lane 3

Lane 4

Lane 5

Lane 6

Lane 7

Lane 8

Lane 9

Lane 10

Lane 11

Lane 12

Lane 13

Lane 14

Lane 15

1 X 8 Controller

1 X 4 Controller

1 2 ... 26 27 28 29 30 31 32 33 34 35 36 ... 111 112

Datasheet – Volume 1 of 2 1
Contents 3
Datasheet, Volume 1 4
Datasheet, Volume 1 5 5
Datasheet, Volume 1 7 7
Revision History 8
1 Introduction 9
Processor 10
1.1 Processor Feature Details 11
1.2 Interfaces 11
1.2.2 PCI Express* 12
Datasheet, Volume 1 31 13
Introduction 13
1.2.5 Processor Graphics 14
1.3 Power Management Support 15
1.4 Processor SKU Definitions 16
1.5 Package 17
1.6 Processor Compatibility 18
1.7 Terminology 19
1.8 Related Documents 22
2 Interfaces 23
2.1.3.1 Single-Channel Mode 25
Flex Memory Technology Mode 25
Interfaces 26
26 Datasheet, Volume 1 26
2.1.5.2 Command Overlap 27
2.2 PCI Express* Interface 28
2.2.1.1 Transaction Layer 29
2.2.1.2 Data Link Layer 29
2.2.1.3 Physical Layer 29
30 Datasheet, Volume 1 30
2.2.3 PCI Express* Port 31
2.3.1 DMI Error Flow 32
2.3.3 DMI Link Down 32
Datasheet, Volume 1 33 33
2.4.1.2 3D Pipeline 34
2.4.1.3 Video Engine 34
2.4.1.4 2D Engine 35
2.4.2.1 Display Planes 36
2.4.2.2 Display Pipes 37
2.4.2.3 Display Ports 37
2.6 Interface Clocking 38
3 Technologies 39
Technologies 40
40 Datasheet, Volume 1 40
Datasheet, Volume 1 41 41
42 Datasheet, Volume 1 42
3.4 Intel 43
Turbo Boost Technology 43
3.5 Intel 44
3.7 Intel 45
64 Architecture x2APIC 45
46 Datasheet, Volume 1 46
4 Power Management 47
(ACPI) States Supported 48
4.2.1 Enhanced Intel 50
SpeedStep 50
Technology 50
4.2.2 Low-Power Idle States 50
C1 C1E C6C3 51
4.2.4.1 Core C0 State 52
4.2.4.2 Core C1 / C1E State 53
4.2.4.3 Core C3 State 53
4.2.4.4 Core C6 State 53
4.2.4.5 C-State Auto-Demotion 53
4.2.5 Package C-States 54
4.2.5.1 Package C0 55
4.2.5.2 Package C1/C1E 55
4.2.5.3 Package C3 State 56
4.2.5.4 Package C6 State 56
Management 56
Datasheet, Volume 1 57 57
Power Management 57
58 Datasheet, Volume 1 58
Datasheet, Volume 1 59 59
4.5 DMI Power Management 60
4.6 Graphics Power Management 60
4.6.4 Intel 61
4.6.5 Intel 61
Graphics Dynamic Frequency 61
62 Datasheet, Volume 1 62
5 Thermal Management 63
Thermal Management 64
64 Datasheet, Volume 1 64
6 Signal Description 65
6.5 Intel 69
Flexible Display (Intel 69
FDI) Interface 69
6.10 Power Sequencing Signals 72
6.11 Processor Power Signals 73
6.12 Sense Signals 73
7 Electrical Specifications 75
Voltage Identification (VID) 76
7.7 Signal Groups 80
7.5 System Agent (SA) V 80
7.10 DC Specifications 84
(Sheet 2 of 2) 85
Specifications 86
DC Specifications 90
Electrical Specifications 92
92 Datasheet, Volume 1 92
8 Processor Land and Signal 93
94 Datasheet, Volume 1 94
Land Name 100
108 Datasheet, Volume 1 108
9 DDR Data Swizzling 109
Table – Channel A 110
112 Datasheet, Volume 1 112
DDR Data Swizzling 112

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