Intel R1304JP4TC Spezifikationen PDF herunterladen (Seite 10)

*Demo only

5032037047784

Note: This riser is included in systems with product

codes ending in S.

FXX1304HSBP

917420

735858223126

5032037019323

Hot swap backplane board spare for 1U 4x3.5”

chassis (R1304 family)

F1U8X25HSBP

917977

735858241014

5032037035767

Hot swap backplane board spare for 1U 8x2.5"

chassis (R1208 family)

*Demo only

FXXCA84X106HS

918318

735858236676

5032037031448

1U Standard Cu/Al 84mm x 106mm Heat Sink

Note: FXXCA84X106HS is an accessory needed

for supporting the Max TDP processor – 135W and

130W Intel

Xeon

Processor E5-1600 Family in

R1000JP system alternatively boxed heatsink

product code STS200P can be utilized.

FXXEA84X106HS

918321

735858236683

5032037031455

1U Standard Ex-Al 84mm x 106mm Heat Sink

This heatsink spare is for all systems (matches the

included system HS).

AXXTPME5

919737

735858240352

5032037035088

Accessory Trusted Platform Module for server

systems (TPM 1.2)

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Intel R1304JP4TC Spezifikationen Seite 10