Intel E8501 Bedienungsanleitung PDF herunterladen (Seite 39)

Intel

E8500/E8501 Chipset North Bridge (NB) and eXternal Memory 39

Bridge (XMB) Thermal/Mechanical Design Guide

XMB Reference Thermal Solution

Full mechanical drawings of the thermal solution assembly and the heatsink are provided in

Appendix B. Appendix A contains vendor information for each thermal solution component.

8.5.1 Heatsink Orientation

Since this solution is based on a unidirectional heatsink, mean airflow direction must be aligned

with the direction of the heatsink fins.

Figure 8-3. XMB Heatsink Board Component Keepout

XMB Location

No Component Keep Out Area

2.48mm Max Component Height

Heatsink Mounting Hole

38.097mm. 48.260mm.

37.500mm.

55.250mm.

63.500mm.

4X Ø 5.5mm

4X Ø 2.95 ± 0.0254mm

37.5mm

Figure 8-4. XMB Heatsink Assembly

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Intel E8501 Bedienungsanleitung Seite 39