Intel CHIPSET 820E Handbücher

Bedienungsanleitungen und Benutzerhandbücher für Computers Intel CHIPSET 820E.
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Intel CHIPSET 820E Bedienungsanleitung (239 Seiten)


Marke: Intel | Kategorie: Computers | Größe: 2.87 MB |

 

Inhaltsverzeichnis

820E Chipset

1

Contents

3

Figures

8

Revision History

12

1. Introduction

13

1.2. Reference Documents

14

1.3. System Overview

15

1.3.1. Chipset Components

16

1.3.2. Bandwidth Summary

17

1.3.3. System Configuration

18

1.4. Platform Initiatives

20

1.4.7. Expanded USB Support

21

1.4.8. Manageability

21

1.4.9. AC’97

23

AC97_conn

24

2. Layout/Routing Guidelines

27

(324-Ball

28

2.3. Intel

29

Data Associated Strobe

33

SBA[7:0] SB_STB

33

2.7.1. Stack-Up

34

2.7.2.1. RSL Routing

35

2.7.2.2. RSL Termination

38

Required

40

Length × Width = Area = C

41

× Thickness of prepreg / [(ε

41

) (1.1)]

41

Recommendation

47

2.7.2.7. Via Compensation

52

1,2,3,4,5,6,7,8,9,10

53

RSL Signals High-Speed

57

CMOS Signals

57

CMOS Signal

57

If Signal Routed from MCH

59

2.8. AGP 2.0

60

Signal Groups

61

Strobe in 2×

62

Associated Strobes

62

AGP_2x-4x_routing

63

All AGP Interfaces

64

2.8.5. AGP Clock Routing

65

2.8.7. V

66

Generation and TYPEDET#

66

TYPEDET# (on Add-in Card) V

67

(Supplied by MB)

67

2.8.8. V

68

1.5-V AGP Card

69

3.3-V AGP Card

69

2.8.9. Compensation

70

2.8.10. AGP Pull-Ups

70

1× 2× 4×

71

(Preferred)

73

“Right-Handed” Orientation

73

(Alternate)

73

2.9. Hub Interface

74

III Processor for the

77

GND Plane

78

2.12. IDE Interface

79

IDE_combo_cable_det

81

IDE_dev_cable_det

82

2.13. AC’97

85

CNR BoardMotherboard

87

CNR Connector

87

Valid Codec Configurations

90

2.13.3. AC’97 Routing

91

2.14. USB

92

2.15. ISA Support

93

2.17. SMBus/SMLink Interface

94

Ω pull-up resistors to 3.3 V

95

2.18. PCI

96

2.19. RTC

96

= (C2 × C3) / (C2 + C3) + C

97

VCC3_3SBY

98

2.21. ICH2 PIRQ Routing

101

2.22. LAN Layout Guidelines

102

Layout Section Previous

103

Reference

103

Design Guide Section

103

2.22.1.1. Bus Topologies

104

Configuration A B C D

105

2.22.1.6. Impedances

106

2.22.1.7. Line Termination

106

LAN_RXD0 LAN_CLK

106

2.22.2.1.2. Signal Isolation

108

Top-Layer Routing

110

Ground Plane

110

Power Plane

110

Bottom Layer Routing

110

82555 or Intel

111

2.22.3. Intel

112

Distance Priority Guideline

114

2.22.4. Intel

115

82562ET / Intel

115

MMBT3906

119

2.22.6. Intel

120

82562ET and Intel

120

82562EH Components’ Dual

120

Footprint Guidelines

120

Capacitors

122

Capacitor Value

122

Design Guide 123

123

2.24. ICH2 Design Checklist

125

Ω ± 3 kΩ

129

2.25. ICH2 Layout Checklist

134

Design Guide 135

135

Table 46. LAN Connect I/F

135

≤ 0.25 inch max

137

138 Design Guide

138

Term Definition

139

Guideline Methodology

141

3.2.3. Pre-Layout Simulation

145

3.2.3.4. Simulation Criteria

146

3.2.4.3. Host Clock Routing

148

3.2.6. Validation

150

Valid delay = T

151

3.3. Theory

152

3.3.3. Crosstalk Theory

153

Decoupling

156

Signal Layer A

157

Signal Layer B

157

3.4.4. Clock Routing

160

3.5.1. V

161

Guard Band

161

3.5.2. Ringback Levels

161

3.5.3. Overdrive Region

161

3.6. Conclusion

162

4. Clocking

163

820_clk_route

166

NOTES:

167

Requirements

168

CPU_div2

168

4.2.3. MCH to DRCG

169

4.2.4. DRCG-to-RDRAM Channel

170

4.2.5. Trace Length

170

Ground CLOCK/CLOCK# Ground

171

PGA370 Designs

173

4.7. Unused Outputs

174

Design Guide 175

175

5. System Manufacturing

177

5.1.2. Design Process

178

5.1.4. Recommended Stack-Up

179

5.1.5. Inner-Layer Routing

179

#1 #2 #3 #4 #5 #6

180

Not Routable

181

182 Design Guide

182

6.1. Power Delivery

183

5 V Dual Switch

185

VCCVID

185

VCC 2.5

185

2.5 VBSY

186

1.8 VSB

188

Design Guide 191

191

6.2. ICH2 Power Plane Split

192

6.3. Thermal Design Power

193

6.4. Glue Chip 3 (Intel

193

820E Chipset Glue Chip)

193

Appendix A: Reference Design

195

Schematics (Uniprocessor)

195

196 Design Guide

196

REVISION 0.5

197

INTEL(R) 820E CHIPSET

197

Block Diagram

198

Device Table

198

370-PIN SOCKET

199

Clock Synthesizer

201

MMBT3904LT1

203

Top Block Lock

206

RIMM Sockets

207

Super I/O

208

AC’97 Audio

209

EEPROMLAN

211

CNR OR LAN DOWN

212

Stuffing Option for

212

LAN (82562EH)

213

LAN (82562ET/EM)

214

LAN (RJ11 For 82562EH)

215

LAN (RJ45 For 82562ET/EM)

216

STUFF FOR 82562EH ONLY

217

STUFF FOR 82562EH

218

STUFF FOR GILAD ONLY

218

AGP Connector

220

PCI Connectors

221

IDE Connectors

223

USB Connectors

224

Parallel Port

225

Serial Ports

226

Keyboard/Mouse/Floppy

227

Game Port

228

Voltage Regulators

230

Power Connector

232

AGTL Termination

233

PCI/AGP Pullups/Pulldowns

234

Rambus* Termination

235

Un-used Gates

236

Hub Interface Connector

239

For debug only

239





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