Intel Chipper 945GC Bedienungsanleitung

Document Number: 307504-004 Intel® 945G/945GZ/945GC/ 945P/945PL Express Chipset Family Thermal and Mechanical Design Guidelines (TMDG) - For

Introduction 10 Thermal and Mechanical Design Guidelines

Product Specifications Thermal and Mechanical Design Guidelines 11 2 Product Specifications This chapter provides the package description and

Product Specifications 12 Thermal and Mechanical Design Guidelines Figure 1. (G)MCH Non-Grid Array 2.2 Package Loading Specifications Table 1

Product Specifications Thermal and Mechanical Design Guidelines 13 2.3 Thermal Specifications To ensure proper operation and reliability of th

Product Specifications 14 Thermal and Mechanical Design Guidelines 2.4.1 Methodology 2.4.1.1 Pre-Silicon To determine TDP for pre-silicon pro

Thermal Metrology Thermal and Mechanical Design Guidelines 15 3 Thermal Metrology The system designer must measure temperatures to accurately

Thermal Metrology 16 Thermal and Mechanical Design Guidelines Figure 2. 0° Angle Attach Methodology (top view, not to scale) Figure 3. 0° Angl

Thermal Metrology Thermal and Mechanical Design Guidelines 17 Figure 4. Airflow Temperature Measurement Locations Airflow velocity should be m

Thermal Metrology 18 Thermal and Mechanical Design Guidelines

Reference Thermal Solution Thermal and Mechanical Design Guidelines 19 4 Reference Thermal Solution The reference component thermal solution f

2 Thermal and Mechanical Design Guidelines INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LI

Reference Thermal Solution 20 Thermal and Mechanical Design Guidelines Figure 5. Processor Heatsink Orientation to Provide Airflow to (G)MCH He

Reference Thermal Solution Thermal and Mechanical Design Guidelines 21 Figure 6. Processor Heatsink Orientation to Provide Airflow to (G)MCH He

Reference Thermal Solution 22 Thermal and Mechanical Design Guidelines Figure 7. ATX GMCH Heatsink Installed on Board

Reference Thermal Solution Thermal and Mechanical Design Guidelines 23 Figure 8. Balanced Technology Extended (BTX) GMCH Heatsink Installed on

Reference Thermal Solution 24 Thermal and Mechanical Design Guidelines 4.4 Environmental Reliability Requirements The environmental reliabilit

Enabled Suppliers Thermal and Mechanical Design Guidelines 25 Appendix A Enabled Suppliers Current suppliers for the Intel® 945G/945GZ/945GC/94

Enabled Suppliers 26 Thermal and Mechanical Design Guidelines Table 6. (G)MCH Balanced Technology Extended (BTX) Intel Reference Heatsink Enab

Mechanical Drawings Thermal and Mechanical Design Guidelines 27 Appendix B Mechanical Drawings The following table lists the mechanical drawing

Mechanical Drawingss 28 Thermal and Mechanical Design Guidelines Figure 9. (G)MCH Package Drawing

Mechanical Drawings Thermal and Mechanical Design Guidelines 29 Figure 10. (G)MCH Component Keep-Out Restrictions for ATX Platforms 8X PLATED

Thermal and Mechanical Design Guidelines 3 Contents 1 Introduction...

Mechanical Drawingss 30 Thermal and Mechanical Design Guidelines Figure 11. (G)MCH Component Keep-Out Restrictions for Balanced Technology Exte

Mechanical Drawings Thermal and Mechanical Design Guidelines 31 Figure 12. (G)MCH Reference Heatsink for ATX Platforms – Sheet 1 2X 58.62.307[]2

Mechanical Drawingss 32 Thermal and Mechanical Design Guidelines Figure 13. (G)MCH Reference Heatsink for ATX Platforms – Sheet 2 2X 60.6.0 2

Mechanical Drawings Thermal and Mechanical Design Guidelines 33 Figure 14. (G)MCH Reference Heatsink for ATX Platforms – Anchor 65.21 0.12.205.

Mechanical Drawingss 34 Thermal and Mechanical Design Guidelines Figure 15. (G)MCH Reference Heatsink for ATX Platforms – Ramp Retainer Sheet 1

Mechanical Drawings Thermal and Mechanical Design Guidelines 35 Figure 16. (G)MCH Reference Heatsink for ATX Platforms – Ramp Retainer Sheet 2 B

Mechanical Drawingss 36 Thermal and Mechanical Design Guidelines Figure 17. (G)MCH Reference Heatsink for ATX Platforms – Wire Preload Clip AA

Mechanical Drawings Thermal and Mechanical Design Guidelines 37 Figure 18. (G)MCH Reference Heatsink for Balanced Technology Extended (BTX) Platf

Mechanical Drawingss 38 Thermal and Mechanical Design Guidelines Figure 19. (G)MCH Reference Heatsink for Balanced Technology Extended (BTX) Pl

Mechanical Drawings Thermal and Mechanical Design Guidelines 39 Figure 20. (G)MCH Reference Heatsink for Balanced Technology Extended (BTX) Platf

4 Thermal and Mechanical Design Guidelines Figures Figure 1. (G)MCH Non-Grid Array...

Thermal and Mechanical Design Guidelines 5 Revision History Revision Number Description Date -001 • Initial Release May 2005 -002 • Added

6 Thermal and Mechanical Design Guidelines

Introduction Thermal and Mechanical Design Guidelines 7 1 Introduction As the complexity of computer systems increases, so do power dissipatio

Introduction 8 Thermal and Mechanical Design Guidelines 1.1 Terminology Term Description BGA Ball Grid Array. A package type defined by a res

Introduction Thermal and Mechanical Design Guidelines 9 1.2 Reference Documents Document Comments Intel® 945G/945GZ/945P/945PL Express Chipset