Intel E8500 Bedienungsanleitung PDF herunterladen (Seite 19)

Intel

E8500 Chipset North Bridge (NB) and eXternal Memory 19

Bridge (XMB) Thermal/Mechanical Design Guide

5 Thermal Metrology

The system designer must make temperature measurements to accurately determine the thermal

performance of the system. Intel has established guidelines for proper techniques to measure the

NB/XMB die temperatures. Section 5.1 provides guidelines on how to accurately measure the

NB/XMB die temperatures. Section 5.2 contains information on running an application program

that will emulate anticipated maximum thermal design power. The flowchart in Figure 5-1 offers

useful guidelines for thermal performance and evaluation.

5.1 Die Case Temperature Measurements

To ensure functionality and reliability, the T

case

of the NB/XMB must be maintained at or between

the maximum/minimum operating range of the temperature specification as noted in Table 3-1 and

Table 3-2. The surface temperature at the geometric center of the die corresponds to T

case

Measuring T

case

requires special care to ensure an accurate temperature measurement.

Temperature differences between the temperature of a surface and the surrounding local ambient

air can introduce errors in the measurements. The measurement errors could be due to a poor

thermal contact between the thermocouple junction and the surface of the package, heat loss by

radiation and/or convection, conduction through thermocouple leads, and/or contact between the

thermocouple cement and the heatsink base (if a heatsink is used). For maximize measurement

accuracy, only the 0° thermocouple attach approach is recommended.

Zero Degree Angle Attach Methodology

1. Mill a 3.3 mm (0.13 in.) diameter and 1.5 mm (0.06 in.) deep hole centered on the bottom of

the heatsink base.

2. Mill a 1.3 mm (0.05 in.) wide and 0.5 mm (0.02 in.) deep slot from the centered hole to one

edge of the heatsink. The slot should be parallel to the heatsink fins (see Figure 5-2).

3. Attach thermal interface material (TIM) to the bottom of the heatsink base.

4. Cut out portions of the TIM to make room for the thermocouple wire and bead. The cutouts

should match the slot and hole milled into the heatsink base.

5. Attach a 36 gauge or smaller calibrated K-type thermocouple bead or junction to the center of

the top surface of the die using a high thermal conductivity cement. During this step, ensure no

contact is present between the thermocouple cement and the heatsink base because any contact

will affect the thermocouple reading. It is critical that the thermocouple bead makes

contact with the die (see Figure 5-3).

6. Attach heatsink assembly to the NB/XMB and route thermocouple wires out through the

milled slot.

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Intel E8500 Bedienungsanleitung Seite 19