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XMB Reference Thermal Solution

38 Intel

E8500 Chipset North Bridge (NB) and eXternal Memory

Bridge (XMB) Thermal/Mechanical Design Guide

8.3 Mechanical Design Envelope

While each design may have unique mechanical volume and height restrictions or implementation

requirements, the height, width and depth constraints typically placed on the E8500 chipset XMB

thermal solution are showing in Figure 8-2.

When using heatsinks that extend beyond the XMB reference heatsink envelope shown in

Figure 8-2, any motherboard components placed between the heatsink and motherboard cannot

exceed 2.48 mm (0.10 in.) in height.

8.4 Board-Level Components Keepout Dimensions

The locations of holes pattern and keepout zones for the reference thermal solution are shown in

Figure 8-3.

8.5 XMB Heatsink Thermal Solution Assembly

The reference thermal solution for the chipset XMB component is a passive extruded heatsink with

thermal interface. It is attached to the board by using four retaining Tuflok fasteners. Figure 8-4

shows the reference thermal solution assembly and associated components.

Figure 8-2. XMB Reference Heatsink Volumetric Envelope

Heatsink Fin

48.26 mm.

63.50mm.

45.50mm.

Heatsink Base

26.60 mm.

Motherboard

Heatsink Fin

4.5 mm.

2.60 mm.

FCBGA + Solder Balls

Die + TIM

30.26 mm.

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Intel E8500 Bedienungsanleitung Seite 38