Intel B940 Datenblatt Seite 77
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Datasheet, Volume 2 77
Processor Configuration Registers
2.8.12 C0CYCTRKWR—Channel 0 CYCTRK WR Register
2.8.13 C0CYCTRKRD—Channel 0 CYCTRK READ Register
B/D/F/Type: 0/0/0/MCHBAR
Address Offset: 256–257h
Reset Value: 0000h
Access: RW
Bit Attr
Reset
Value
Description
15:12 RW 0h
Activate To Write Delay (C0sd_cr_act_wr)
This field indicates the minimum allowed spacing (in DRAM clocks) between
the ACT and WRITE commands to the same rank-bank.
This value corresponds to the tRCD_wr parameter in the DDR3 specification.
11:8 RW 0h
Same Rank Write To Write Delay (C0sd_cr_wrsr_wr)
This field indicates the minimum allowed spacing (in DRAM clocks) between
two WRITE commands to the same rank.
7:4 RW 0h
Different Rank Write to Write Delay (C0sd_cr_wrdr_wr)
This field indicates the minimum allowed spacing (in DRAM clocks) between
two WRITE commands to different ranks.
This value corresponds to the tWR_WR parameter in the DDR3 specification.
3:0 RW 0h
Read To Write Delay (C0sd_cr_rd_wr)
This field indicates the minimum allowed spacing (in DRAM clocks) between
the READ and WRITE commands.
This value corresponds to the tRD_WR parameter.
B/D/F/Type: 0/0/0/MCHBAR
Address Offset: 258–25Ah
Reset Value: 000000h
Access: RO, RW
Bit Attr
Reset
Value
Description
23:21 RO 000b Reserved
20:17 RW 0h
Minimum Activate To Read Delay (C0sd_cr_act_rd)
This field indicates the minimum allowed spacing (in DRAM clocks) between
the ACT and READ commands to the same rank-bank.
This value corresponds to tRCD_rd parameter in the DDR3 specification.
16:12 RW 00h
Same Rank Write To Read Delayed (C0sd_cr_wrsr_rd)
This field indicates the minimum allowed spacing (in DRAM clocks) between
the WRITE and READ commands to the same rank.
This value corresponds to the tWTR parameter in the DDR3 specification.
11:8 RW 0h
Different Ranks Write To Read Delayed (C0sd_cr_wrdr_rd)
This field indicates the minimum allowed spacing (in DRAM clocks) between
the WRITE and READ commands to different ranks.
This value corresponds to the tWR_RD parameter in the DDR3 specification.
7:4 RW 0h
Same Rank Read To Read Delayed (C0sd_cr_rdsr_rd)
This field indicates the minimum allowed spacing (in DRAM clocks) between
two READ commands to the same rank.
3:0 RW 0h
Different Ranks Read To Read Delayed (C0sd_cr_rddr_rd)
This field indicates the minimum allowed spacing (in DRAM clocks) between
two READ commands to different ranks.
This value corresponds to the tRD_RD parameter.
- Datasheet – Volume 2 1
- Legal Lines and Disclaimers 2
- Contents 3
- 4 Datasheet, Volume 2 4
- Datasheet, Volume 2 5 5
- 6 Datasheet, Volume 2 6
- Datasheet, Volume 2 7 7
- 8 Datasheet, Volume 2 8
- Datasheet, Volume 2 9 9
- 10 Datasheet, Volume 2 10
- Datasheet, Volume 2 11 11
- Revision History 12
- 1 Introduction 13
- Introduction 14
- 2 Processor Configuration 15
- 2.2 System Address Map 17
- 18 Datasheet, Volume 2 18
- 2.2.1 Legacy Address Range 19
- Datasheet, Volume 2 21 21
- 2.2.2.2 TSEG 22
- 2.2.2.5 Pre-allocated Memory 23
- 2.2.2.7 Intel 24
- Management Engine (Intel 24
- ME) UMA 24
- Datasheet, Volume 2 25 25
- 2.2.2.10 High BIOS Area 26
- Datasheet, Volume 2 27 27
- 2.2.3.1 Programming Model 28
- HOST/SYSTEM VIEW 29
- PHYSICAL MEMORY 29
- (DRAM CONTROLLER VIEW) 29
- Datasheet, Volume 2 33 33
- 34 Datasheet, Volume 2 34
- 2.2.9 I/O Address Space 35
- 36 Datasheet, Volume 2 36
- Datasheet, Volume 2 37 37
- 2.4 Configuration Mechanisms 38
- Datasheet, Volume 2 39 39
- 40 Datasheet, Volume 2 40
- Datasheet, Volume 2 41 41
- 42 Datasheet, Volume 2 42
- Datasheet, Volume 2 43 43
- 2.6 I/O Mapped Registers 44
- 2.7.6 CC—Class Code Register 49
- TXT Lockable 54
- 1:0 to 11b 56
- 4) from 58
- B0h, bits 15:4) 58
- 2.8 MCHBAR Registers 66
- 00h RW 67
- Register Symbol Register Name 67
- 208–209h 73
- 20A–20Bh 74
- 24D–24Fh 74
- 250-251h 75
- 252–255h 76
- 256–257h 77
- 258–25Ah 77
- 269–26Eh 79
- 298–29Bh 82
- 29C–29Fh 84
- 2B4–2B7h 84
- 600–601h 86
- 602–603h 86
- 604–605h 86
- 64D–64Fh 88
- 650–651h 88
- 652–655h 89
- 656–657h 90
- 658–65Ah 90
- 660–663h 91
- 6B4–6B7h 93
- C20–C27h 94
- 1001–1002h 94
- 1004–1005h 95
- 101E–101Fh 100
- Register 107
- 10EC–10EDh 108
- 2C20–2C22h 109
- 2.9 EPBAR Registers 110
- 2.10 PCI Device 1 Registers 115
- PCI device 117
- Port Command Register 140
- 11:10 RW-O 11b 143
- OS's during run time 155
- 104–107h 156
- 108–10Bh 157
- 10C–10Dh 157
- 110–113h 158
- 23 RO 0b Reserved 158
- 114–117h 158
- 11A–11Bh 159
- 2.12 DMIBAR Registers 161
- Declaration Capability 169
- 2.13.6 CC—Class Code Register 177
- Range Address Register 179
- GMADR register 180
- 2.14 Device 2 I/O Registers 183
- 100–107h 211
- 108–10Fh 212
- 200–20Fh 214
- F00–F03h 215
- F04–F07h 216
- Dedication 217
- F08–F0Bh 218
- FFC–FFFh 219
- 2.16 DMI VC1 REMAP Registers 221
- 2.17.2 GFXPLL1—GFX PLL BIOS 254
- 2.18 GFXVTBAR Registers 255
- Address Register 281
- 2.19 PCI Device 6 Registers 288
- 2.19.45 RSTS—Root Status 327
- 2.21 Intel 332
- Specific Registers 332
- 110–117h 333
- 330–337h 333
- Lower Half Register 334
- Upper Half Register 334
- QuickPath Architecture 335
- System Address Decode 335
- Register Description 335
- QPI Link 0 Registers 340
- QPI Physical 0 Registers 341
- 3.4 PCI Standard Registers 342
- 3.4.4 CCR—Class Code Register 344
- Identification Register 345
- 3.4.7 PCICMD—Command Register 346
- 3.5.1 MAX_RTIDS 349
- 3.6.1 SAD_PAM0123 349
- 3.6.2 SAD_PAM456 351
- 3.6.3 SAD_HEN 352
- 3.6.4 SAD_SMRAM 353
- 3.6.5 SAD_PCIEXBAR 354
- 3.7 Intel 356
- QPI Link Registers 356
- 3.8 Intel 357
- QPI Physical Layer Registers 357
- 360 Datasheet, Volume 2 360
Verwandte Produkte und Handbücher für Prozessoren Intel B940
Prozessoren Intel core 2 Duo T5850 Spezifikationen
(292 Seiten)
(292 Seiten)
Prozessoren Intel AT80569KJ073N Datenblatt
(102 Seiten)
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