Intel mPGA604 Bedienungsanleitung

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Inhaltsverzeichnis

Seite 1 - October 2003

R Document Number: 254239-001 mPGA604 Socket Design Guidelines Revision 1.0 October 2003

Seite 2

Introduction R 10 mPGA604 Socket Design Guidelines This page intentionally left blank.

Seite 3 - Contents

R mPGA604 Socket Design Guidelines 11 2 Assembled Component and Package Description Information provided in this section is to ensure dimensional co

Seite 4 - Figures

Assembled Component and Package Description R 12 mPGA604 Socket Design Guidelines This page intentionally left blank.

Seite 5

R mPGA604 Socket Design Guidelines 13 3 Mechanical Requirements 3.1 Mechanical Supports A retention system needs to isolate any load in excess of 50

Seite 6 - Revision History

Mechanical Requirements R 14 mPGA604 Socket Design Guidelines Proper seating 3.5 Markings All markings required in this section must be able to wit

Seite 7

R Mechanical Requirements mPGA604 Socket Design Guidelines 15 3.6 Socket Size The socket size must meet the dimensions as shown in Figure A-5 and Fi

Seite 8

Mechanical Requirements R 16 mPGA604 Socket Design Guidelines 3.9.6 Lubricants For the final assembled product, no lubricant is permitted on the soc

Seite 9 - 1 Introduction

R Mechanical Requirements mPGA604 Socket Design Guidelines 17 3.16 Critical-to-Function Dimensions The mPGA604 socket shall accept a 604-pin process

Seite 10

Mechanical Requirements R 18 mPGA604 Socket Design Guidelines This page intentionally left blank.

Seite 11 - Package Description

R mPGA604 Socket Design Guidelines 19 4 Electrical Requirements Socket electrical requirements are measured from the socket-seating plane of the pro

Seite 12

R 2 mPGA604 Socket Design Guidelines Notice: This document contains information on products in the design phase of development. The information he

Seite 13 - 3 Mechanical Requirements

Electrical Requirements R 20 mPGA604 Socket Design Guidelines 4.1 Electrical Resistance Figure 4-1 and Figure 4-2 show the proposed methodology for

Seite 14 - 3.5 Markings

R Electrical Requirements mPGA604 Socket Design Guidelines 21 Figure 4-3. Electrical Resistance Fixtures Superimposed

Seite 15 - 3.9 Contact Characteristics

Electrical Requirements R 22 mPGA604 Socket Design Guidelines Table 4-3. Resistance Test Fixtures Netlist DC Endpoints Edgefingers: Hi Edgefing

Seite 16 - 3.9.6 Lubricants

R Electrical Requirements mPGA604 Socket Design Guidelines 23 Table 4-3. Resistance Test Fixtures Netlist (Continued) DC Endpoints Edgefingers:

Seite 17

Electrical Requirements R 24 mPGA604 Socket Design Guidelines 4.2 Determination of Maximum Electrical Resistance This section provides a guideline

Seite 18

R Electrical Requirements mPGA604 Socket Design Guidelines 25 Figure 4-4. Inductance Measurement Fixture Cross-Section No Plane on this Layer Ful

Seite 19 - 4 Electrical Requirements

Electrical Requirements R 26 mPGA604 Socket Design Guidelines 4. Calibration – Cascade Calibration Substrates or equivalent. 5. Measurement object

Seite 20 - 4.1 Electrical Resistance

R Electrical Requirements mPGA604 Socket Design Guidelines 27 for the socket. The shoulder of the interposer is not included in the electrical model

Seite 21

Electrical Requirements R 28 mPGA604 Socket Design Guidelines This page intentionally left blank.

Seite 22

R mPGA604 Socket Design Guidelines 29 5 Environmental Requirements Design, including materials, shall be consistent with the manufacture of units th

Seite 23 - Electrical Requirements

R mPGA604 Socket Design Guidelines 3 Contents 1 Introduction ...

Seite 24 - 4.3 Inductance

Environmental Requirements R 30 mPGA604 Socket Design Guidelines Table 5-1. Use Conditions Environment (Continued) Use Environment Speculative Stres

Seite 25

R Environmental Requirements mPGA604 Socket Design Guidelines 31 5.5 Durability Use per EIA 364, test procedure 09B. The same package pin field is t

Seite 26 - LLL −=

Environmental Requirements R 32 mPGA604 Socket Design Guidelines This page intentionally left blank.

Seite 27 - 4.7 Contact Current Rating

R mPGA604 Socket Design Guidelines 33 6 Validation Testing Requirements This section of the document outlines the tests that must be successfully co

Seite 28

Validation Testing Requirements R 34 mPGA604 Socket Design Guidelines 6.7 Quality Assurance Requirements The OEM’s will work with the socket supplie

Seite 29

R mPGA604 Socket Design Guidelines 35 7 Safety Requirements Design, including materials, shall be consistent with the manufacture of units that meet

Seite 30 - 5.4 Solderability

Safety Requirements R 36 mPGA604 Socket Design Guidelines This page intentionally left blank.

Seite 31 - 5.5 Durability

R mPGA604 Socket Design Guidelines 37 8 Documentation Requirements The socket supplier shall provide Intel with the following documentation: • Mult

Seite 32

Documentation Requirements R 38 mPGA604 Socket Design Guidelines This page intentionally left blank.

Seite 33

R mPGA604 Socket Design Guidelines 39 A Appendix A Figure A-1. 42.5 mm, 604-Pin Package Assembly Drawing (Sheet 1 of 3)

Seite 34

R 4 mPGA604 Socket Design Guidelines 5 Environmental Requirements...

Seite 35 - 7 Safety Requirements

Appendix A R 40 mPGA604 Socket Design Guidelines Figure A-2. 42.5 mm, 604-Pin Package Assembly Drawing (Sheet 2 of 3)

Seite 36

R Appendix A mPGA604 Socket Design Guidelines 41 Figure A-3. 42.5 mm, 604-Pin Package Assembly Drawing (Sheet 3 of 3)

Seite 37

Appendix A R 42 mPGA604 Socket Design Guidelines Figure A-4. mPGA604 Socket Drawing (Sheet 1 of 3)

Seite 38

R Appendix A mPGA604 Socket Design Guidelines 43 Figure A-5. mPGA604 Socket Drawing (Sheet 2 of 3)

Seite 39 - A Appendix A

Appendix A R 44 mPGA604 Socket Design Guidelines Figure A-6. mPGA604 Socket Drawing (Sheet 3 of 3)

Seite 40

R Appendix A mPGA604 Socket Design Guidelines 45 Figure A-7. 603-Pin Interposer Assembly Drawing (Sheet 1 of 7)

Seite 41

Appendix A R 46 mPGA604 Socket Design Guidelines Figure A-8. 603-Pin Interposer Assembly Drawing (Sheet 2 of 7)

Seite 42

R Appendix A mPGA604 Socket Design Guidelines 47 Figure A-9. 603-Pin Interposer Assembly Drawing (Sheet 3 of 7)

Seite 43

Appendix A R 48 mPGA604 Socket Design Guidelines Figure A-10. 603-Pin Interposer Assembly Drawing (Sheet 4 of 7)

Seite 44

R Appendix A mPGA604 Socket Design Guidelines 49 Figure A-11. 603-Pin Interposer Assembly Drawing (Sheet 5 of 7)

Seite 45

R mPGA604 Socket Design Guidelines 5 Tables 2-1 Package Critical-To-Function (CTF) Dimensions ... 11 3

Seite 46

Appendix A R 50 mPGA604 Socket Design Guidelines Figure A-12. 603-Pin Interposer Assembly Drawing (Sheet 6 of 7)

Seite 47 - Appendix A

R Appendix A mPGA604 Socket Design Guidelines 51 Figure A-13. 603-Pin Interposer Assembly Drawing (Sheet 7 of 7)

Seite 48

Appendix A R 52 mPGA604 Socket Design Guidelines This page intentionally left blank.

Seite 49

R 6 mPGA604 Socket Design Guidelines Revision History Revision Number Description Date 1.0 • Initial release of the document. October 2003

Seite 50

R mPGA604 Socket Design Guidelines 7 Re-Validation Notice to Socket Vendors Any significant change to the socket will require submission of a detaile

Seite 51

R 8 mPGA604 Socket Design Guidelines This page intentionally left blank.

Seite 52

R mPGA604 Socket Design Guidelines 9 1 Introduction 1.1 Objective This document defines a surface mount, Zero Insertion Force (ZIF) socket intended

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