Intel E8500 Bedienungsanleitung PDF herunterladen (Seite 7)

Intel

E8500 Chipset North Bridge (NB) and eXternal Memory 7

Bridge (XMB) Thermal/Mechanical Design Guide

1 Introduction

As the complexity of computer systems increases, so do the power dissipation requirements. Care

must be taken to ensure that the additional power is properly dissipated. Typical methods to

improve heat dissipation include selective use of ducting, and/or passive heatsinks.

The goals of this document are to:

• Outline the thermal and mechanical operating limits and specifications for the Intel

E8500

chipset North Bridge (NB) component and the Intel

E8500 chipset eXternal Memory Bridge

(XMB) component.

• Describe two reference thermal solutions that meet the specification of the E8500 chipset NB

component.

• Describe a reference thermal solution that meets the specification of the E8500 chipset XMB

component.

Properly designed thermal solutions provide adequate cooling to maintain the E8500 chipset die

temperatures at or below thermal specifications. This is accomplished by providing a low local-

ambient temperature, ensuring adequate local airflow, and minimizing the die to local-ambient

thermal resistance. By maintaining the E8500 chipset die temperature at or below the specified

limits, a system designer can ensure the proper functionality, performance, and reliability of the

chipset. Operation outside the functional limits can degrade system performance and may cause

permanent changes in the operating characteristics of the component.

The simplest and most cost effective method to improve the inherent system cooling characteristics

is through careful chassis design and placement of fans, vents, and ducts. When additional cooling

is required, component thermal solutions may be implemented in conjunction with system thermal

solutions. The size of the fan or heatsink can be varied to balance size and space constraints with

acoustic noise.

This document addresses thermal design and specifications for the E8500 chipset NB and XMB

components only. For thermal design information on other chipset components, refer to the

respective component datasheet. For the Intel

6700PXH 64-bit PCI Hub, refer to the

Intel

6700PXH 64-bit PCI Hub Thermal Design Guidelines. For the ICH5, refer to the

Intel

82801EB I/O Controller Hub 5 (ICH5) and Intel

82801ER I/O Controller Hub 5 R

(ICH5R) Thermal Design Guide.

1.1 Design Flow

To develop a reliable, cost-effective thermal solution, several tools have been provided to the

system designer. Figure 1-1 illustrates the design process implicit to this document and the tools

appropriate for each step.

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