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LGA775 Socket Heatsink Loading

Thermal and Mechanical Design Guidelines 71

Figure 7-6. Board Deflection Definition

d’1

d’2

A.3.2 Board Deflection Limits

Deflection limits for the ATX/µATX form factor are:

d_BOL – d_ref≥ 0.09 mm and d_EOL – d_ref ≥ 0.15 mm

And

d’_BOL – d’_ref≥ 0.09 mm and d_EOL’ – d_ref’ ≥ 0.15 mm

NOTES:

1. The heatsink preload must remain within the static load limits defined in the processor

datasheet at all times.

2. Board deflection should not exceed motherboard manufacturer specifications.

1 2 ... 66 67 68 69 70 71 72 73 74 75 76 ... 125 126

Contents 3
Figures 6
Revision History 8
1 Introduction 9
1.1.3 Document Scope 10
1.2 References 11
1.3 Definition of Terms 11
Ψ measurements 12
Information 13
2.1.2 Heatsink Attach 15
2.2 Thermal Requirements 16
2.2.2 Thermal Profile 17
2.2.4 T 18
2.3.1 Heatsink Size 20
2.3.2 Heatsink Mass 20
2.3.3 Package IHS Flatness 21
2.4.3 Summary 23
3 Thermal Metrology 25
3.1.1 Example 26
Assessment 27
Guidelines 27
Thermal Metrology 28
Thermal Monitor Feature 31
4.2.1 PROCHOT# Signal 32
4.2.3 Thermal Monitor 2 33
4.2.5 On-Demand Mode 35
4.2.6 System Considerations 35
Considerations 36
4.2.8 THERMTRIP# Signal 36
(BTX) Thermal/Mechanical 39
Design Information 39
5.1.2 Acoustics 40
5.1.3 Effective Fan Curve 41
Airflow (cfm) 42
5.1.5 Altitude 43
5.2.2 Power Cycling 45
5.4 Safety Requirements 47
Reference BTX 47
Thermal Module Assembly 47
Less curvature in region 48
Shock Load 48
6 ATX Thermal/Mechanical 51
6.2.1 Heatsink Performance 53
6.2.2 Acoustics 54
6.2.3 Altitude 54
PSD (g^2/Hz) 56
6.3.2 Power Cycling 57
6.5 Safety Requirements 59
Reference ATX 59
Thermal Mechanical Design 59
Less curvature in 60
Core shoulder 61
Φ36.14 +/- 0.10 mm 62
Φ38.68 +/- 0.30 mm 62
7 Intel 63
Quiet System 63
Technology (Intel 63
(Output Weighting Matrix) 64
RPM Temperature 65
Intel® (G)MCH 66
7.3 Intel 68
Loading 69
Metrology 75
Heatsink Clip Load Metrology 76
Load Cells (3x) 77
Preload Fixture (copper 77
B.3 Test Procedure Examples 78
Measurement 79
Appendix C Thermal Interface 81
Management 81
Thermal Interface Management 82
Appendix D Case Temperature 83
Reference Metrology 83
D.4 IHS Groove 85
TC Wire with Insulation 92
IHS with Groove 92
D.5.3 Solder Process 95
Installation 98
Extended (BTX) System 103
Thermal Considerations 103
TMA Airflow 105
Reference Design 107
BOARD PRIMARY SIDE 110
BOARD SECONDARY SIDE 111
Mechanical Drawings 112
Figure 7-54. Intel 124
Appendix H Intel 125
Enabled Reference 125
Solution Information 125

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